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Metalmach Micro Technology Sdn Bhd added 4 photos in High Precision Tools & Dies Category.Sep 02, 2021 at 06:17 pm. —
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Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semic ... https://m.mmtsb.com/index.php?ws=showproducts&products_id=3695843
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