Wirebond Parts - Clamper
Wirebond Parts - Clamper High Precision Tools & Dies Negeri Sembilan, Malaysia Manufacturer, Supplier, Provider  | Metalmach Micro Technology Sdn Bhd
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.

Please leave your enquiry here, we will reply as soon as possible.

*only support gif, jpeg, jpg, png, pdf
Switch To Desktop Version